Chinese memory chipmaker ChangXin Memory Technologies, or CXMT, is reportedly nearing the end of research and development validation for its first LPDDR6 chip, moving it closer to mass production in the race for next-generation mobile memory.
Citing industry sources, domestic media reports said the chip is designed to reach a data rate of 12,800 megabits per second, with a base operating rate of 10,667 Mbps when paired with a system-on-chip.
The chip reportedly features a 16-gigabit die, a packaged capacity of 16 gigabytes and a 1,295-ball package-on-package design. Its power efficiency, reliability, availability and serviceability have also been improved from CXMT’s LPDDR5X products, according to the reports.
Published by the Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association in July 2025, the LPDDR6 standard aims to meet growing demand for faster and more energy-efficient memory in mobile devices and AI applications. Its higher data throughput is expected to support memory-intensive tasks such as running AI models directly on devices and high-frame-rate gaming.
The reported progress would place CXMT among the early contenders in the industry’s transition to LPDDR6.
South Korea’s SK Hynix, CXMT’s most advanced competitor based on publicly disclosed progress, announced in March that it had developed a 16Gb LPDDR6 DRAM chip using its sixth-generation 10-nanometer-class, or 1c, process. The new product is expected to be 33 percent faster and over 20 percent more power-efficient than LPDDR5X, SK Hynix said.
SK Hynix is preparing to begin mass production of LPDDR6 memory in the second half of 2026, according to South Korean outlets. Chinese electronics manufacturer Xiaomi is expected to be its first customer, with the new memory reportedly set to debut in the company’s next-generation flagship smartphone.
Tanks to chinadaily.com.cn
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